The rectangular shape allowed integrated circuits to be packaged more densely than previous round packages. The first devices had 14 pins and looked much like they do today. The original dual-in-line package was invented by Bryant "Buck" Rogers in 1964 while working for Fairchild Semiconductor. Other devices in DIP packages include resistor networks, DIP switches, LED segmented and bargraph displays, and electromechanical relays.ĭIP connector plugs for ribbon cables are common in computers and other electronic equipment.ĭallas Semiconductor manufactured integrated DIP real-time clock (RTC) modules which contained an IC chip and a non-replaceable 10-year lithium battery.ĭIP header blocks on to which discrete components could be soldered were used where groups of components needed to be easily removed, for configuration changes, optional features or calibration. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a PCB and which allow higher density of interconnections.Īn operating prototyped circuit on a solderless breadboard incorporating four DIP ICs, a DIP LED bargraph display (upper left), and a DIP 7-segment LED display (lower left).ĭIPs are commonly used for integrated circuits (ICs). a resistor array, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. Variations of the DIP package include those with only a single row of pins, e.g.
Some sockets include a zero insertion force mechanism. Where replacement of the parts is necessary, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Most DIP packages are secured to a PCB by inserting the pins through holes in the board and soldering them in place. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. DIP plugs for ribbon cables can be used with standard IC sockets.ĭIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. Common packages have as few as three and as many as 64 leads. The photograph at the upper right shows three DIP14 ICs. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.Ī DIP is usually referred to as a DIP n, where n is the total number of pins. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule) eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. In microelectronics, a dual in-line package ( DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins.
8 contact DIP switch with 0.3" wide 16-pin (DIP-16N) footprint